|by MAC | January 8, 2018|
Intel and Micron Announce Plans to Split 3D NAND Development
In 2005, Intel and Micron made public their agreement to a form a joint company that was solely focused on the development and manufacturing of non-volatile memory. This led to the founding of Intel-Micron Flash Technologies (IMFT) in 2006, and the subsequent creation of three fabrication plants.
Throughout the years this long-running partnership successfully delivered some excellent planar NAND memory, and led to the creation of both 3D NAND and the new groundbreaking 3D XPoint memory technology. The innovation continues as IMFT is actually currently rolling out second generation 3D NAND.
However, both companies just announced a decision to begin separately developing 3D NAND sometime in early 2019, following the completion and delivery of their jointly designed third generation 3D NAND technology. Having said that, Intel and Micron will continue working together to further develop and manufacture 3D XPoint memory at their Utah fab, which is now entirely focused on 3D XPoint production.
While this might seem like a random development, this collaboration began weakening as far back as 2012 when Intel sold its stake in two of the three factories back to Micron for $600 million. Furthermore, those in the know have long seen January 2018 as a focal point of this joint partnership ever since the following was noticed on page 80 of Micron's 2014 Annual Report:
Intel: Press Release.
Micron: Press Release.
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