|by 3oh6 | June 17, 2009|
Package & Memory Overview
Package & Memory Overview
Before we get to some pre-biblical battle of epic proportions - perhaps a little over stated - let's have a look at the modules that we are going to be working with today and the package they came in.
Right out of the gate we are impressed. OCZ has really stepped up their game in the package department. Not only is the memory aesthetically pleasing from the outside, but it is clearly in a better package to be shipping across the country. The majority of computer hardware sales these days are done on the internet and that means hardware having to be shipped, not in bulk. With triple channel memory kits, the molded blister pack was starting to fail for three sticks of memory. Too much weight means the possibility of the package opening should the retailer not take the care to properly secure it for shipping. OCZ eliminates that possibility by wrapping the molded plastic in a simple - yet effective - cardboard package. It is light weight, basic, and provides everything memory needs in order to be safe in a UPS truck. That's right, even UPS couldn't hurt this package. Yeah, I went there. What is the point of writing reviews if you don't get a shot in at UPS?
As mentioned, the memory contained inside this package is still secured by molded plastic blister packs, but they are not loose and do not have the ability to open during transport. The cardboard package is thin but still extremely effective at doing its intended task of keeping the memory safe. Some day someone will come up with a better solution than the molded plastic package (cough cough Crucial cough cough), but until then, this is a fine second choice in our opinions and other manufacturers should follow suit if they already haven't. We know G.Skill has been doing this for years, so this isn't really OCZ's brilliant idea, but a well implemented one none the less.
There isn't really much to say about heat spreaders on memory so we will just let the photo's do most of the talking. We can see that the Blade heat sink is really a unique design with a few interesting elements to it. First off is the rough granite surface that can be seen in the second photo above. We love this finish and would take this over a smooth polished finish any day. The cuts and grooves along the body and in the top portion help to increase surface area of the heat sink which helps in heat dissipation, but again, aesthetics likely play a more important role in heat sink design than anything these days. Overall, the two piece design really is a well done unit.
As mentioned, there are two pieces to the Blade heat sink, a front and a back. We can see where they join in the second photo above. We can also see that the top portion is hollow providing even more surface area to potentially remove heat from the modules. Being hollow this makes the Blade modules not as heavy as one would think, but us being us, we would prefer the beefy feel despite the lack of any productive benefits weight would bring to the memory. Of course, the biggest question is going to be how these heat sinks will interact with large processor cooling solutions such as the Thermalright Ultra-120 and its variations. That is something we will find out soon enough after we finish up here and take a look at the specifications a little further.
Our last photo above is a nice macro shot of the heat sinks showing the thermal material used between the Blade heat sink and the actual memory IC's. OCZ appears to be using a thin thermal pad that looks like it should do a fine job of transferring heat to the outside walls of the heat sinks. We still prefer a cured thermal interface material like Corsair and other manufacturers have started to use but this material is a nice alternative that many manufacturers seem to be sticking with...pardon the pun. Or don't pardon it, your choice.
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