Korean electronics giant Samsung has begun the production of embedded multi-chip package (eMCP) memory for use in entry and midlevel smartphones.

“As the need is growing for more advanced software and increased data storage in smartphones and tablets, mobile device makers are expected to introduce embedded memory solutions throughout 2012 that offer higher performance and density,” said Myungho Kim, Samsung’s vice president of memory marketing in a press release. “Samsung will further accelerate growth in the mobile device market as it extends the advanced memory segment by providing a more expansive line-up of eMCP solutions in 2012.”

The eMCP solutions are fabricated in packages that include 4GB e-MMC (Embedded MultiMediaCard) based on 20nm class NAND flash memory, and a choice of 256MB, 512MB, or 768MB of 30nm class LPDDR2 DRAM.

The 30 nm-class LPDDR2 DRAM chip in the new eMCPs performs a key role in enhancing the performance of entry- to mid-level smartphones with a data transmission speed of 1,066 megabits per second (Mbps), which doubles the performance of the industry’s previous mobile DRAM (MDDR)m, according to Samsung.