The GIGABYTE Open Overclocking Championship (GO OC) 2009, the world’s largest Overclocking competition, successfully took place June 3, 2009. The 4 regional final winners and last year’s GO OC 2008 Best P45 Overclock and Free Style champions battled it out for 5 hours of serious competition, and GIGABYTE is pleased to announce team USA 1, consisting of teammates Fugger and Vapor was crowned GO OC 2009 Worldwide Final champions.

GO OC 2009 kicked off with an opening speech from Henry Kao, Vice President of GIGABYTE Channel Business. “Starting in February this year, GIGABYTE held GO OC 2009 country qualifiers in 26 countries worldwide followed by regional finals in Czech, Thailand, USA and China. After 4 months of serious competition, we have an exceptional 4 teams of overclockers as well as last year’s GO OC 2008 champions ready to compete. Let’s give them all a round of applause to congratulate on making it to the worldwide GO OC 2009 final.”

Following was an ice breaking ceremony by Henry Kao and all vendors wishing the contestants success in breaking the current world records for 3DMark and SuperPI.

(GIGABYTE associate VP, Tony Liao; Kingston Product Manager of Memory Modules, Ann Bai; NVIDIA VP, Corporate Marketing, Rob Csongor; Intel Director of Microprocessor Product Marketing, Zane Ball; GIGABYTE VP, Henry Kao; ENERMAX Sales Manager, Paul Xu; Intel SSD Director of Embedded Sales Group & Ultra Mobility Group-Asia Pacific, Michael Chen; Intel  Director, Channel Platform Strategy Division, Chris Tobias)

In addition to the overclocking competition area, GIGABYTE had on display a time tunnel highlighting GIGABYTE GO OC 2009′s history, including images from this year’s 26 country qualifiers and 4 regional finals. Also on showcase were several live and static demos, including motherboards featuring GIGABYTE’s latest 2 oz copper PCB with Ultra Durable™ 3 technology, as well as a sneak peak of Intel’s upcoming P55 platform. 

GIGABYTE also showcased the latest high-end products from the sponsors of the event as well as the hardware used for the competition. First class hardware is the key to achieving successful, record-breaking overclocks, and GIGABYTE was honored to have several industry-leading venders including Intel, NVIDIA, Kingston and ENERMAX to participate in this historic event.

GIGABYTE is excited to announce Team USA (Fugger and Vapor) broke the 3DMark Vantage world record for GTX 260 Dual Card SLI with PhysX disabled with a score of 28,093. The Belgium Team PT1T and Massman won the SuperPI competition with a score of 6mins 40secs in SuperPI 32m with Intel Core™ i7 975 Processor Extreme Edition and GIGABYTE GA-EX58-UD5. The frequency they were able to run this benchmark at was 5.634GHz, proving GIGABYTE’s GA-EX58-UD5 overclocking ability with a 76% performance boost over the default 3.2GHz with 4 cores, 8 threads.

GO OC 2009 will be remembered by overclockers and enthusiasts alike as the biggest and most extreme overclocking competition in history. So what does GIGABYTE have in store for GO OC 2010? You’ll just have to wait until next year to find out. 

(Group Photo: Kingston, NVIDIA, Intel, GIGABYTE and ENERMAX)	(GO OC Venue: Taipei 101 skyscraper, Taiwan)

GO OC 2009 Competition Results

(Champions of GO OC 2009, Fugger & Vapor)