December 18, 2006, 10:53 PM
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 AMD and IBM Detail Early Results Using Immersion and Ultra Low-K in 45NM Chips
"At the International Electron Device Meeting (IEDM) today, IBM (NYSE: IBM) and AMD (NYSE: AMD) presented papers describing the use of immersion lithography, ultra-low-K interconnect dielectrics, and multiple enhanced transistor strain techniques for application to the 45nm microprocessor process generation. AMD and IBM expect the first 45nm products using immersion lithography and ultra-low-K interconnect dielectrics to be available in mid-2008." More @ AMD's Pressroom
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Originally Posted by 3.0charlie  My knuckles are bleeding from fishing through walls a new CAT6 network cable... I found fresh, untapped electrical outlets...  | "It's all in the Reflexes"-Jack Burton |
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