Go Back   Hardware Canucks > NEWS & REVIEWS > Press Releases & Tech News

LinkBack Thread Tools Display Modes
  #1 (permalink)  
Old May 18, 2007, 10:25 PM
Babrbarossa's Avatar
Hall Of Fame
Join Date: Dec 2006
Location: New Brunswick
Posts: 3,727

My System Specs

Default New NanoGlue could revolutionize chip manufacture

PORTLAND, Ore. An organic low-k dielectric material called organosilane is capable of forming bonds among copper interconnects that are five times stronger than current tantalum compounds, according to a material scientist at Rensselaer Polytechnic Institute.

"This material is already commercially available, but we discovered quite by accident that it can withstand the high heats used to manufacture semiconductors," said Ganapathiraman Ramanath, who worked with researchers at IBM's T.J. Watson Research Center (Yorktown Heights, N.Y.) and the Technion-Israel Institute of Technology (Haifa, Israel). "When used as a nanoglue between copper and silicon dioxide, it actually gets stronger above 400 degrees Celsius, which was quite a surprise to us," Ramanath added.

Look at the rediculous illustration!!!

More from EETimes
Reply With Quote

Thread Tools
Display Modes

Similar Threads
Thread Thread Starter Forum Replies Last Post
Good little chip - E4500 zlojack Overclocking, Tweaking and Benchmarking 2 March 9, 2008 07:04 AM
BIOS Chip burning JShupka Troubleshooting 13 January 22, 2008 11:21 PM
New Bios chip / Reflash ebdoradz Overclocking, Tweaking and Benchmarking 6 January 22, 2008 08:56 PM
Intel's new chip w/questions UberMoo CPU's and Motherboards 15 November 14, 2007 07:19 PM
Next Nvidia high end chip will be the G81 Babrbarossa Press Releases & Tech News 0 January 26, 2007 07:37 AM