New NanoGlue could revolutionize chip manufacture

[Babrbarossa]

PORTLAND, Ore. — An organic low-k dielectric material called organosilane is capable of forming bonds among copper interconnects that are five times stronger than current tantalum compounds, according to a material scientist at Rensselaer Polytechnic Institute.

"This material is already commercially available, but we discovered quite by accident that it can withstand the high heats used to manufacture semiconductors," said Ganapathiraman Ramanath, who worked with researchers at IBM's T.J. Watson Research Center (Yorktown Heights, N.Y.) and the Technion-Israel Institute of Technology (Haifa, Israel). "When used as a nanoglue between copper and silicon dioxide, it actually gets stronger above 400 degrees Celsius, which was quite a surprise to us," Ramanath added.

Look at the rediculous illustration!!!



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