Mushkin Ascent 2x2GB PC3-12800 DDR3 Kit Review

We begin this section with a quick look at the Mushkin packaging and then we will move on to the modules themselves. We have to warn you in advance, these modules are beefy looking and in this reviewers opinion, absolutely gorgeous. There is no bias here, we all just think that these modules are just so tough looking. Simply picking up the package makes them feel powerful because of the sheer weight alone.

Mushkin has gone with the standard plastic clamshell/cardboard insert for the packaging of the Ascent memory and at first we were a bit hesitant in seeing this. The problem is that heavy modules sometimes have the tendency to come loose from their mount in this type of package and during transport, being free as a bird in a clamshell is not that safe. Unlike other manufacturers who use the same package, the Mushkin clamshell is very secure and the memory is quite snug inside. There are no signs of this clamshell wanting to open like a jack-in-the-box despite the beefy nature of the Ascent heat sinks. We wanted to complain about the package but when it works well, there is nothing negative we can say.

Moving onto the memory itself, we can see that they are obviously black which is half the reason these modules look like they could take out a biker gang on their own. In addition to the Mushkin branded sticker on one side of the memory outlining the specifications and model number, the Mushkin logo is also presented directly on the heat sink in the top left corner of each side. The heat sinks appear to be held into place by a pair of clips and the important thing here is how far down the clips actually come on the memory. If the heat sink were not there, these clips would almost touch the bottom of the ICs. This is extremely important because what this should provide is a solid and even contact across the entire length of the ICs underneath.

In the photos above we can again see the complete coverage by the heat sink clips which will ensure that no lifting of the heat sinks at the bottom of the modules will occur. Adjusting our focus to the top of the heat sinks we get an idea of the thickness of these modules. The four fins are spaced evenly apart providing more surface area to dissipate heat. This surface area is again increased with the ribs running along the sides from the bottom to almost the top of the memory. The ribs also played a cosmetic role in the design process we would imagine. In the second photo above, we have shown a couple angles where we can see what appears to be a split in the heat sink right in the middle of the module. This indicates that the heat sinks can pull completely apart and are a two piece design. We of course will be trying to get 'into' the modules a little bit later on to see the all important ICs underneath.

From a top down view of the Ascent heat sinks, the modules look really fat but as we will see in the installation section, this doesn't interfere in anyway once mounted in the DIMM slots. The last photo is about as good a shot of the technology behind the Ascent name and the unique cooling it offers without taking the heat sinks off as we will get. We can see the flattened heat pipe looking copper layer in between the outer shell and the ICs that are mounted to the PCB. The thermal material that plays the role of transferring heat to the vapor chambers appears to be a thin thermal pad similar to what Crucial and Buffalo offer on their Ballistix and FireStix lines of memory. It is hard to get a good idea exactly what the thermal material is made of until it comes off the modules which we will attempt to see shortly in the Specifications section, so let's go there now.