Packaging & Memory Overview
Packaging & Memory Overview
Although most consumers will never even see the packaging of the products they buy online before ordering them, a little attention to detail does go a long way towards creating a positive initial impression when they receive their purchase. As a result, let's see what G.Skill have done with this new industry-leading memory kit.
Foregoing the needlessly large box or more common plastic clamshell packaging, G.Skill ships this model in a compact yet highly stylized package. The box itself is sealed with a security sticker, so you will know if it has been previously opened. Inside is a single plastic tray that holds the two modules. It can be opened by hand - no knife required unlike with blister packs - which means that they are resealable. There is also a little case sticker included, but no instruction or warranty booklet, which is fine by us.
These Trident Z modules features one of the most striking heatspreader designs that we have seen on any memory kit. Featuring thick slabs of aluminium, one black side, one dark grey side, red accents on both sides and on top, and attractive multi-layer fins, these are good looking modules that will match up perfectly with the ocean of red & black motherboards on the market.
Each module features a sticker with the model number, essential specs, serial number, data of production, and a security sticker proving that is a genuine G.Skill product. Even the PCB comes stamped with the module's size and speed, further ensuring that the memory you are receiving is legitimate. Speaking of the PCB, these modules are manufactured with a 10 layer design, which is not only a sign of quality but also ensures better conductive heat transfer.
One of the only downsides of the attractive heatspreaders are their height which measure 44mm/1.73in tall. That is not super tall, but you can still definitely expect clearance issues when using certain motherboard and heatsink combinations, like the ASUS B150 PRO Gaming Aura motherboard and Prolimatech Mega Shadow heatsink.
As noted in the introduction, this memory kit comes in clocked at DDR4-3600 16-16-16-36 with a 2T command rate. It requires 1.35V - up from the 1.20V default - which is identical to other enthusiast-oriented memory kits. This is all programmed into one of the XMP 2.0 profiles, so enabling these settings is as simple as toggling the XMP option in your motherboard's BIOS. This XMP profile keeps the BCLK at 100Mhz so there is no accompanying CPU overclock, and while the Uncore was raised from the stock 4000Mhz to 4100Mhz, that seems to simply be the default for all ASUS Z170 motherboards that we've tested at the moment.
This kit has a party trick in the form of a second XMP 2.0 profile with less aggressive specifications, namely DDR4-2666 13-12-12-32-2T at 1.20V. CPU-Z did not seem to be able to correctly list this second XMP profile, but it worked fine in our testing.
Although we did not remove the heatspreaders, we can say with certainty that this memory kit is manufactured with the brand new Samsung B-die ICs, specifically known as K4A8G085WB, which are the best overclocking DDR4 memory chips for large memory kits. Case in point, these particular modules are actually single-sided, so we wouldn't be surprised to see a 32GB (2x16GB) model sometime in the future.
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