| Patriot Viper 2x1GB DDR3 PC3-15000 Review | ||
| by 3oh6 | February 8, 2008 | ||
| Package & Memory Overview Package & Memory Overview: The next order of business is to have a quick look at the package and then the modules. This Viper Fin series certainly sounds impressive and quite unique, let's have a closer look. ![]() This is the second kit of memory in a row that has not shown up in a boring plastic molded case with nothing more than a cardboard insert. It must be our lucky month here at Hardware Canucks, or there is movement away from the boring packaging of ages past. Patriot has decided to create a very nice cardboard package exterior for their memory and has even included a window to show off the fancy new Viper Fin heat sinks. The rear of the package contains simple marketing copy describing the company as well as technical support contact information and a description of the warranty offered by patriot. ![]() The overall design of the package is very impressive and makes these Viper Fin sticks look very professional before we even pull them out. Once we do get inside the package the professionalism continues. Each module is individually secured in a plastic container protecting the memory during transport. One of the plastic cases contains a small leaflet labeled as the installation guide. This package provides ample security for the memory and much like the G.Skill memory we just reviewed a short while ago, the package brought a little excitement to the memory that has been lost since the molded plastic package became standard. A fancy package is obviously not necessary and has no impact on how the memory performs but it wouldn't cost manufacturers a whole lot more for a package of this kind and the presentation of the memory dramatically increases with this type of design. ![]() As mentioned, there is an insert in the Patriot package that provides in rather good detail, handling instructions, installation instructions, and a brief bit of information on timings and how to set them in the BIOS according to specifications. Let's now move on to the modules themselves, these heat sinks are certainly something new and should provide a few decent photos. ![]() Obviously the first thing that is apparent with the Viper Fin heat sinks is the fact that they are taller than the standard size PCB. This extra height is almost standard design these days with recent Super Talent, Corsair, and OCZ modules coming with heat sinks that protrude upwards. Motherboard manufacturers were aware of this trend years ago and in combination with the large CPU heat sinks we see these days, adjust the designs accordingly. Of course there are still certain combinations of CPU heat sink and motherboard that will limit the slots available to us with these modules but we will look at that in the installation section. ![]() Aside from the height of these modules, they don't appear to have any other characteristics that would cause an issue. There is a lot of surface area thanks to the ribs and fence-like peaks but the Viper Fin heat sinks are not overly thick or obtrusive. If your setup will have no height issues, these modules can certainly be used in a four module side by side configuration. In the photo just above to the right, we can really see the integrated copper on the exposed surface of the cooling fins. This must be the aluminum copper composite that Patriot refers to on their web site. It certainly is not something found on any other modules and innovation is always welcome when it comes to cooling. ![]() Moving in for a closer look we have circled the location of where the ICs interface with the Viper Fin heat sinks. If we look closely we can see what appears to be a translucent and very thin film of adhesive. This is obviously what holds the heat sinks to the modules and should act as a very good conductor of heat. The only problem is that 1/3 of the IC isn't making contact with the heat sink as shown in the photo to the right. Obviously the heat sinks can't simply be moved down to cover the entire IC because this would put those bottom fins almost flush with the contacts and the memory would not be able to install in a DIMM slot. If the heat sinks only method for cooling the ICs is through direct contact, it would be desirable to have the entire IC in contact with the heat sink. Based on that logic, it would make more sense if the heat sink went a little further down and covered the entire IC. On the plus side, this tiny bit of exposed IC all but confirms it is Micron with the tell tale markings. | ||
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