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| by 3oh6 | January 25, 2008 | ||
| Package & Memory Overview Package & Memory Overview:
![]() As well saw through the clear plastic package, one side of the modules has a Project X sticker while the other displays the memory specifications on a Super Talent sticker proudly displaying the made in U.S.A. declaration. The sticker contains the part number, kit size, rated speed, timings, and a small UPC bar code as well as what is believed to be a serial number. The modules are covered in a flat black finish giving them a very "tough" feel when combined to the ribbed peaks along the top of the module. The project X sticker has a nice touch with the word Project being an iridescent finish to it changing colors at various angles in the light. ![]() Earlier versions of these Project X modules did not come with a heat sink on the back of the module but they obviously do now. It likely doesn't add any cooling performance, rather is simply there for esthetic purposes. The heat sinks on the front half of the modules are hardly just esthetic additions. The photo just above on the right shows us the thermal adhesive gripping the ICs on the one side of the module. Super Talent claims this to be some sort of special thermal material but it looks to be very similar to others seen on various modules for years. We won't be pulling the heatspreaders on these modules as the thought of destroying this expensive DDR3 memory doesn't sit well in our stomachs. We will now move on to seeing what comes up during installation of these lanky modules. ![]() | ||
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