Super Talent Project X 2x1GB DDR3 PC3-14400 Review

by 3oh6     |     January 25, 2008

Package & Memory Overview:

Your standard molded plastic packageYour standard molded plastic packageThe Super Talent Project X memory showed up in a commonly seen package consisting of a plastic clam shell with a cardboard insert. The modules are held securely in place in the form fitted plastic shell and proudly put on display through the clear plastic.

If you have bought a kit of memory in the last three or four years, then you have likely seen this type of package. It quickly became the industry standard once heat sinks started to be the norm on performance memory and manufacturers started selling dual-channel kits back in the DDR days. There are a number of positives and not a lot of negatives to this type of package so it really isn't a surprise to see it thriving so many years later.

It has come up a couple times in enthusiast computer forums that the modules with large and heavy heatsinks have had trouble staying secure in the plastic clam shell so when this Super Talent memory arrived it was the first thing checked. The Project X modules are very secure in the clips showing no sign of getting free and going for a walk within the clam shell. Perhaps it was because the plastic shell was nice and tight holding the modules well or just the packing that Super Talent did, but either way, there was no risk of either stick coming free and being damaged. The cardboard insert simply contains some Super Talent marketing copy and no real information about the modules as this job is left to the sticker on the actual module. It would be nice to see some sort of installation and handling instructions added to the package to assist those users that may not be familiar with memory installation.

As well saw through the clear plastic package, one side of the modules has a Project X sticker while the other displays the memory specifications on a Super Talent sticker proudly displaying the made in U.S.A. declaration. The sticker contains the part number, kit size, rated speed, timings, and a small UPC bar code as well as what is believed to be a serial number. The modules are covered in a flat black finish giving them a very "tough" feel when combined to the ribbed peaks along the top of the module. The project X sticker has a nice touch with the word Project being an iridescent finish to it changing colors at various angles in the light.

Earlier versions of these Project X modules did not come with a heat sink on the back of the module but they obviously do now. It likely doesn't add any cooling performance, rather is simply there for esthetic purposes. The heat sinks on the front half of the modules are hardly just esthetic additions. The photo just above on the right shows us the thermal adhesive gripping the ICs on the one side of the module. Super Talent claims this to be some sort of special thermal material but it looks to be very similar to others seen on various modules for years. We won't be pulling the heatspreaders on these modules as the thought of destroying this expensive DDR3 memory doesn't sit well in our stomachs. We will now move on to seeing what comes up during installation of these lanky modules.

 
 
 

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