Specifications:  There isn't a whole lot to cover when it comes to memory specifications as everything can be summed up in a couple easy lines of acronyms and numbers. The one thing worth discussing is the fact that those not familiar with DDR3 memory timings are going to think that 7-7-7 is very loose when compared to DDR or even DDR2 timings. The reality is that DDR3 memory runs at such a high frequency when compared to DDR/DDR2 memory. Being rated for 7-7-7-21 timings at 900MHz or an effective DDR3-1800, these Project X modules are considered to be extremely low latency modules.
The graphic on the left outlines the specifications for these modules and one item that stands out is the fact that these modules are comprised of only 8 ICs which is something we saw on in a previous OCZ Platinum DDR3 review here at Hardware Canucks.com. This again means that only one side of the modules is populated with 128MB ICs leaving us with a 1024MB or 1GB stick of memory. Of course, these modules are only sold in a 2x1Gb configuration making this a 2GB kit of memory.
We have speculated in the past about which ICs are powering DDR3 memory but the timings, frequency, and density of the Project X memory all points to these modules being populated with Micron D9GTR or even D9GTS ICs.  There are currently no other modules available at this time that allow DDR3 memory to run at 900MHz with 7-7-7 timings aside from the Micron D9 line of ICs. D9GTR ICs are rated for 533MHz operating frequency at CL7 with 1.5v. D9GTS is rated for 667MHz at CL9 with 1.5v. Either IC would obviously be running above specification in order to run on these modules at 900MHz and that is why the specified voltage for these modules is 2.0v. With this added voltage comes added heat and the Project X heat sink is the crowning jewel of these modules to deal with that issue.
Comprised of what looks to be cast aluminum, the Project X heat sink is quite a substantial piece of hardware. Super Talent describes the heat sinks to have "double the surface area and 106% more aluminum mass than standard heat spreaders". This extra mass and surface area is connected to the ICs backside via Super Talents "special thermal adhesive".
Despite being something never seen on Super Talent memory before, these heat sinks are far from unique taking many ques from other manufacturers heat sink design by adding added surface area with a rippled surface and added height through the means of fence-like peaks emerging from the top of the PCB. The added height is a bit of a double edge sword as we will see in the installation section shortly. For now though, let's have a closer look at these modules and the package that they come in.
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