DFI LanParty UT X58-T3eH8 LGA 1366 Motherboard Review

Package & Accessories

As of late, buying a motherboard feels more like buying a suitcase. Some of the packages we have been receiving and purchasing in computer shops have been absolutely monstrous. The EVGA 790i packages for example, could double as a side table in a pinch. The DFI UT X58-T3eH8 fits right into the trend with a very thick and overall large package. Measuring in at 12cm thick, 30cm wide, and almost 40cm tall; the X58-T3eH8 package is quite substantial. This increase in package size seems to co-exist with the rather steep increase in premium motherboard prices starting with C2D socket 775 motherboards. Apparently these companies have a complex and feel by selling us larger packages, it somehow justifies the ridiculous costs. That of course is just a theory, but one that would be hard to argue with. Either way, let's take a look at some photos of the DFI UT X58-T3eH8 package from the outside. We will then dive inside and check for appropriate protection.

The overall feel of the package is quite subdued and very modern in its design. The front and rear of the package don't really impose a lot of information about the motherboard inside but they do a solid job of visually catching the buyer’s attention. We find the traditional LanParty UT logo in a few locations as DFI is still actively branding the LanParty logo but it certainly isn't as prominent as the LanParty packages of say the socket 939 days when the LanParty motherboard series was legendary. The one close up we have taken of the packages back side is the one thing we have been drooling over for years before the X58 chipset came along; NVIDIA SLI and ATI CrossFire logos co-existing in harmony. We cannot stress it enough, the fact that both SLI and CrossFireX are able to run on the same motherboard is probably the most important aspect of the new Core i7 processors, and it has nothing to do with the processor.

We mentioned the lack of detailed information on the outside of the package about the motherboard, that job is handled by the inside flap of the front cover. This is where DFI has chosen to promote the various features and specifications of the X58-T3eH8. The information contained here is remarkably similar to the features section we just showed in the previous section. We also get a glimpse of the actual motherboard through a couple windows designed to highlight the Flame Freezer heat sink attachment and Bernstein Audio module. Before we look at those items, we dive inside the package and find a motherboard securely contained in a large molded plastic clam shell. It is hard to see but there are a couple pieces of foam taped to the underside of the top fold which act as mechanisms to holding the motherboard in place. The plastic shell isn't quite as solid or well formed to the motherboard like the EVGA X58-SLI motherboard we recently reviewed, but it still does a fabulous job holding the motherboard still and protecting it on its journey. Which, by the way, was made in the back of a UPS package crushing vehicle and despite the big brown doing the delivering duties, our package was in pristine condition when we received it. It turns out UPS isn't rough on every package, just 99.9% of them.

The accessories package included with the LanParty UT X58-T3eH8 are where we start to see the personality of the UT series of old. In case you didn't notice, the IDE/floppy cable sleeving and SATA cables are a neon, UV reactive green. Like everything else, they are tucked neatly in a separate box from the motherboard shell. Here is a full list of the items we can see in the two photos shown above:

• 1 x Sleeved UV reactive IDE Cable
• 1 x Sleeved UV reactive floppy cable
• 4 x UV reactive SATA cables
• 2 x 4-Pin molex connector > dual 5-Pin SATA connector
• Solid 2 Way SLI bridge
• Solid 3 Way SLI bridge
• Flexible CrossFireX bridge
• Smart Connectors for front panel connections and USB/FIreWire onboard headers
• Package of 4 jumpers
• Small tube of thermal paste and applicator card
• Ribbon cable for audio module
• Manual & software CD + installation guide
• Rear I/O panel

As we predicted in the EVGA X58-SLI review, X58 motherboards are starting to come with CrossFireX bridges as evidence here. The flexible CrossFireX bridge companions the two solid SLI bridges. We also have a small tube of thermal paste and applicator card which would be seemingly used for the Flame Freezer cooler but we aren't quite sure how the applicator card works. Perhaps it is used to apply thermal paste on the heat sink base when adding the Flame Freezer attachment to the NB portion of the heat sink. Speaking of the Flame Freezer, let's take a look at it now.

The Flame Freezer attachment isn't all that complicated but DFI has made it look quite impressive. It is simply a nickel plated copper heat pipe that is bent in a fashion to connect with the cooling fins. The DFI touch is that the cooling fins are separated by a uniquely designed aluminum piece. The heat pipe appears to be 6mm in diameter. This attachment will obviously be the focus for our thermal testing of the motherboard. Since we should have an accurate temperature reading from the digital PWM and X58 north bridge, we should really be able to see how much the Flame Freezer works on reducing temperatures.

We also have the Bernstein Audio module pictured above. Other motherboard manufacturers have started using vertical soundcards for onboard sound but DFI has been doing this forever with Bernstein modules. The idea is that moving the "onboard" soundcard off the board, interference from the motherboard is minimized in the audio. DFI implements this in a PCI expansion bracket which then connects to the motherboard with a ribbon cable that we saw earlier in the accessory package photos.

Next up is going to be a closer look at the motherboard in all of its UV reactive green and yellow glory.