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Old June 13, 2010, 10:49 PM
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Default How Do You Apply Thermal Compound?

Hello!

I am a beginner builder and was wondering how to put thermal compound onto the CPU?

There are two methods that I have learned, but I people have said both methods have advantages and disadvantages.

Pea Method: Apply pea-sized blob on the center of CPU and then put on the heatsink.

Spread Method: Apply blob of compound, spread over whole top of the CPU.

Which method is better? Or is there an even better method?

All help is appreciated.
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Old June 13, 2010, 10:55 PM
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Pea blob is best, since the pressure from applying the heatsink will spread the paste, leaving no space for air bubbles to form.

Unless you have a HDT (Heatpipe direct touch) cooler, then some say it is better to do the 2nd method since it fills in the cracks better.
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Old June 13, 2010, 11:29 PM
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like Jake_HT said, a pea sized dot, and put the heatsink down and it'll spread it.
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Old June 14, 2010, 01:44 AM
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Use the better methods listed in this article depending on what kind of heatsink you have: http://benchmarkreviews.com/index.ph...d=170&Itemid=1
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Old June 26, 2010, 03:54 AM
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As I don't disagree with the members above, no bigger than pea size, from my experience half a pea size works best for me because 1) it enough to cover the CPU when heatsink is installed and 2) not too much to spill over causing a mess.

All the best!
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Old July 6, 2010, 11:16 PM
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I would have to say that the x method is the best but pea is the easiest.
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Old July 7, 2010, 08:18 AM
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I randomly just end up doing one or the other with out really thinking lol.
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Old July 7, 2010, 09:42 AM
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Pea method for me. Amount depends on which paste Im using. For example you need much less AS5 than that diamond stuff.
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Old July 7, 2010, 10:24 AM
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i used to spread, now i pea. that sounds kinda awful
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Old July 7, 2010, 10:52 AM
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Pea method mostly but for naked chips I still spread....unless it is ic7 then pea is the only option.
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