How Do You Apply Thermal Compound?
I am a beginner builder and was wondering how to put thermal compound onto the CPU?
There are two methods that I have learned, but I people have said both methods have advantages and disadvantages.
Pea Method: Apply pea-sized blob on the center of CPU and then put on the heatsink.
Spread Method: Apply blob of compound, spread over whole top of the CPU.
Which method is better? Or is there an even better method?
All help is appreciated.
Pea blob is best, since the pressure from applying the heatsink will spread the paste, leaving no space for air bubbles to form.
Unless you have a HDT (Heatpipe direct touch) cooler, then some say it is better to do the 2nd method since it fills in the cracks better.
like Jake_HT said, a pea sized dot, and put the heatsink down and it'll spread it.
Use the better methods listed in this article depending on what kind of heatsink you have: http://benchmarkreviews.com/index.ph...d=170&Itemid=1
As I don't disagree with the members above, no bigger than pea size, from my experience half a pea size works best for me because 1) it enough to cover the CPU when heatsink is installed and 2) not too much to spill over causing a mess.
All the best! :thumb:
I would have to say that the x method is the best but pea is the easiest.
I randomly just end up doing one or the other with out really thinking lol.
Pea method for me. Amount depends on which paste Im using. For example you need much less AS5 than that diamond stuff.
i used to spread, now i pea. that sounds kinda awful
Pea method mostly but for naked chips I still spread....unless it is ic7 then pea is the only option.:angry2:
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