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Old December 13, 2008, 01:53 PM
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A big factor is whether or not you lap your processor. A lapped processor will require much less TIM to work properly.
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Old December 13, 2008, 02:09 PM
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A big factor is whether or not you lap your processor. A lapped processor will require much less TIM to work properly.
Exactly I always try and lap HSF at the least. I have lapped my processor if I bought it used as the warranty at the point doesn't matter.
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Old December 13, 2008, 02:19 PM
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A big factor is whether or not you lap your processor. A lapped processor will require much less TIM to work properly.
A lapped processor doesn't yield enough results imho to bother doing it.
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Old December 13, 2008, 06:59 PM
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Grain of rice size in the middle (ceramique). No spreading. Just add the HSF and good to go. This allows the paste to spread out as the HSF is locked down eliminating any chance of micro air bubbles forming. This was the method that Arctic Silver recommended when I looked into it a few years back.

This brought up the question whether this method is still valid. So I checked out the AS site and found these links:

Arctic Ceramique for Intel cores

Acrtic Ceramique for AMD cores

Arctic Silver 5 for Intel cores

Arctic Silver 5 for AMD cores

Guess my method aint what it use to be.
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Old December 13, 2008, 07:05 PM
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Been doing the "grain of rice in the center" method for quite some time now. :)
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Old December 16, 2008, 01:12 AM
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Rice grain size or less, then i spread it very thinly.
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