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Old June 8, 2014, 07:18 AM
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However, the TIM itself is/was only half the problem the other half was the gap between the IHS and the core (from the glue and overall IHS design). More gap = more goop needed= higher temps. My guess this whiz bang new 'next gen' TIM is another Dow Corning paste but they have quietly shortened the gap between the two.
This I have not heard of and honestly I am not sure about this "gap" you speak of. Where did you hear about it? On this forum I created a thread concerning the delidding, re TIM'ing and re gluing of the IHS to the cpu. I completed this process on two 3770k and one 3570k. To my knowledge there is no gap issue because after replacing the TIM my temp drops were dramatic.