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Old June 7, 2014, 06:36 PM
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AkG AkG is offline
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Join Date: Oct 2007
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Considering the 'solder' they used was pure indium and had a thermal conductivity rating of about 86 W/(m * K)...and most TIMs on the market are about 1/10 of Its not going to be as good as the solder. However, the TIM itself is/was only half the problem the other half was the gap between the IHS and the core (from the glue and overall IHS design). More gap = more goop needed= higher temps. My guess this whiz bang new 'next gen' TIM is another Dow Corning paste but they have quietly shortened the gap between the two....and are just puting all the credit on to the TIM as that is what peeps have been complaining about. ;)
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