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Old August 28, 2010, 06:43 PM
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Wow Farrow2005 , yah snuck that reponse by me.Did'nt see it till now.

Thermal Interface Material is not required when doing submersion cooling . The submersion liquid acts as the TIM when there is a heasink on......We actually ran the e6600 sans heatsink in the first thinktank2 trial , it did'nt boot but the chip was on......awesome localized boiling in the IPA.

Thats one of the goals of this project.NO heatsinks.

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