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Old February 20, 2010, 06:24 AM
windwithme windwithme is offline
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Join Date: Jul 2009
Posts: 535
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IO
1 X DVI-D
1 X HDMI
1 X D-SUB
4 X USB 2.0(yellow)
2 X USB 3.0(blue)
1 X eSATA/USB 2.0 combo
1 X S/PDIF fiber/coaxial output
1 X 1394a


H55M-USB3 uses 4 phase PWM design. It is mid range components in H55 MB.


USB 3.0 chip is NEC D720200F1
Also using 3x USB power design which each USB port had independent chip to supply voltage. Itís 3 times current more.
It can avoid access problem for external devices power shortage.


H55 chipset heat sink
Due to H55 heat is not high, it doesnít need big surface heat sink.



Boot up screen


MB Intelligent Tweaker, also known as M.I.T.
The below is BIOS version and other status.


Adjust CPU ratio, clock and DRAM clock items


F3a BIOS will show the GPU clock item


CPU related technology items. I have introduced many times in other articles.


Advanced DRAM setup page
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