View Single Post
  #20 (permalink)  
Old July 20, 2009, 11:03 AM
Dadi_oh's Avatar
Dadi_oh Dadi_oh is offline
Top Prospect
 
Join Date: Sep 2008
Location: Almonte, Ontario
Posts: 180
Default

Quote:
Originally Posted by AmuseMe View Post
So in layman's terms, crank that oven to 500C, and bake 8 minutes?


No I wouldn't do that. I spent a little time reading through that thread and looks like lot's of people used 400F. You also apparently need to be careful of electrolytic capacitors (the tall barrel shaped ones) so best to keep it lower as a starting point.

It is possible that a complete reflow is not necessary. Just enough liquidity to repair the cracked joint.

And there was some good advice about not bumping the oven while doing it. When the solder goes liquid the surface tension should hold things in place but if you jar it then you could move a component ( = bad )

You also need to let it cool before moving it. I would open the oven door after the 8 minutes and that way you let the solder re-crystalize and everything firms up. And that would also reduce the thermal shock of a sudden cooling. The manufacturing reflow overns go through a controlled cool down so that is what you are shooting for.

I wish I had a dead card to try. I had a 7900GT that stopped working but I tossed it out. One of the few times I have ever thrown something away
__________________
Rig1: Q9550 @3.8GHz Vendetta 2, P5Q-PRO, 6GB OCZ Reaper PC2-8500. 5870 1GB, GT240 Physx, Ultra LSP 750W, 2TB internal + 2TB external, 3X23" 5760X1080 eyefinity + GT240 Physx, HAF22 case 3X200mm : Win7 Pro
Rig2: E8200 @3.6GHz Vendetta HSF, DFI P45 LP-JR, 4GB 900MHz, 4870 512MB, X203W 20", Ultra Gladiator Case
Rig3: Q6600@ 3.5GHz H50, P5Q-PRO, 8GB, 8800GTS512, OCZ GameXStream 850W, Samsung 245BW 24" + 19" dual: Snow Leopard + Parallels Win7
Rig4: MAC mini Snow Leopard
Laptop: Macbook Pro 15"
Reply With Quote