Quote:
Originally Posted by AmuseMe  Just did some googling. Found all info I need. Hardforum.com has t wenty-three (23) pages of it working for people: http://www.hardforum.com/showthread.php?t=1421792 I'll start this Friday. BTW: 1: Remove the heat sink and thermal paste – clean well
2: Preheat oven to 385F to 400F (NO HIGHER!) (gas mark 6)
3: Lay foil over the oven rack
4: Make four (4) balls of foil, about 4cm high
5: When the oven is heated to its correct temperature, put the graphics card on the four (4) balls, (one on each corner)
6: Leave for around 6-10 minutes, NO MORE THAN 12 OR IT WILL MELT
(hardforum.com) |
Just FYI here is some background on solder reflow method used in manufacturing.
Reflow soldering - Wikipedia, the free encyclopedia
Another source on lead free solder (which the 4870X2 would be) suggests the following:
The reflow process window for conventional soldering is relatively wide. The melting point of the eutectic solder is 183ºC. The lower temperature limit for reflow is usually 200ºC and upper limit is about 235ºC. The lead-free alloy used for BGA solder balls has a melting point of 217ºC and requires a minimum reflow temperature of 235ºC to ensure good wetting. Maximum reflow temperature is in the 245ºC to 260ºC range, depending on complexity and density of the board.
Looks like 500F is the absolute max. For lead free solder somewhere around 217C (423F) to 235C (455F). Any modern PC components are going to use lead-free solder if they want to be able to sell in Europe so these temps suggest something higher than the 400F max recommended in the original post.
You could try at the lower limit first and see if it works. If not you might try moving up the scale without exceeding 245C (473F). And don't exceed about 8 minutes in the oven for any of these temps.